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Back to Home » December 2016 News » TSV Stacked Memory Patent Landscape |
TSV Stacked Memory Patent Landscape |
December 01, 2016
LONDON, Nov. 30, 2016 /PRNewswire/ --
A FAST GROWING TSV MEMORY MARKETIn the semiconductor industry, 3D integration using through-silicon via (TSV) has been considered to be a promising way for improving performance and density instead of conventional device scaling. By connecting...
Source URL: http://www.prnewswire.com/news-releases/tsv-stacked-memory-patent-landscape-300371060.html
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